鄧濤，是上海交通大學教授，曾榮獲中國科學技術大學郭沫若獎。
鄧濤，博士，國家中央組織部“千人計畫”入選者，上海交通大學材料科學與工程學院“致遠”講席教授。1996年畢業於中國科學技術大學材料科學與工程系，獲得無機材料化學學士學位。同年進入美國哈佛大學化學系攻讀博士學位。讀博期間主攻非常規微納米結構及系統的製備並於2001年獲得無機材料博士學位。2001－2003年在美國麻省理工學院材料科學與工程系進行微納光子晶體方向的博士後研究。2003年進入美國通用電氣公司研發總部任職。回國前擔任通用電氣研發總部的資深研究員，並擔任過多個通用電氣公司及美國政府項目的首席研究員。受邀在多個國際學術會議做報告，並多次參與組織國際學術會議。發表了40多篇學術論文（被他人引用超過1700次），60多篇通用電氣公司內部技術報告，40多項新材料性能，製備及加工專利和專利申請。 榮獲中國科學技術大學郭沫若獎，多項通用電氣公司優秀人才，傑出技術，及專利獎，國際機械工程大會（2008）及國際電氣工程大會（2010）最佳論文獎,並於2011年入選美國工程院百名優秀年輕工程師項目。主要研究方向為仿生材料和微納米仿生器件的製備及功能研究，包括仿生材料在能源的轉換與儲存，生物與化學檢測，和光學調控方面的研究與套用。
代表性論著
1. Ababneh, M.; Gerner, F.; Hurd, D.; De Bock P.; Chauhan, S.; Deng, T. "Charging Station of a Planar Miniature Thermal Ground Plane", Journal of Heat Transfer, 2012, Accepted.
2. Pris, A.; Utturkar, Y.; Surman, C.; Morris, W.; Vert, A.; Zalyubovskiy, S.; Deng, T.; Ghiradella, H.; Potyrailo, R. "Towards High-Speed Imaging of Infrared Photons with Bio-Inspired Nanoarchitectures", Nature Photonics, 6, 195 (2012).
3. Deng, T; Chauhan, S.; Russ, B.; Eastman, C.; De Bock, H. P. J.; Chamarthy, P.; Weaver, S. A. “High Performance Thermal Ground Plane”, World Journal of Engineering, Special Issue ICCE-19, 2011.
4. De Bock, H. P. J.; Deng, T; Chauhan, S.; Russ, B.; Eastman, C.; Chamarthy, P.; Weaver, S. A. “Development and Experimental Validation of a Micro/Nano Thermal Ground Plane”, Proceedings of the ASME/JSME Joint Thermal Engineering Conference, 2011, Honolulu, Hawaii, USA.
5. Deng, T. “Manufacturing Processes and Methodologies in Nanotechnology”, book chapter in Intelligent Energy Field Manufacturing & Interdisciplinary Process Innovations, CRC Press, 2010.
6. Varanasi, K. K.; Hsu, M. F.; Bhate, N.; Yang, W. S.; Deng, T. “Controlling the Nucleation and Growth of Water Using Hybrid Hydrophobic-Hydrophilic Surfaces”, Proceedings of the 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2010, Las Vegas, Nevada, USA.
7. De Bock, H. P. J.; Chamarthy, P.; Chauhan, S;Weaver, S. A.; Deng, T. “On the Charging and Thermal Characterization of a Micro/Nano Structured Thermal Ground Plane”, Proceedings of the 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2010, Las Vegas, Nevada, USA.
8.Varanasi, K. K.; Deng, T.;Hsu, M.; Bhate, N. “Wetting Hysteresis, Metastability, and Droplet Impact on Superhydrophobic Surfaces”, Proceedings of ASME InterPACK 2009, San Francisco, California, USA.
9. Chamarthy, P.; De Bock, H. P. J.; Russ, B.; Chauhan, S.; Rush, B.; Weaver, S. A.; Deng, T.; Varanasi, K. “Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures”, Proceedings of ASME InterPACK 2009, San Francisco, California, USA.
10. Potyrailo, R. A.; Ding, Z.; Butts, M. D.; Genovese, S. E.; Deng, T. “New Approach for Selective Vapor Sensing Using Structurally Colored Self-Assembled Films”, book chapter in Advanced Photonic Sensors, Springer, 2009
11. Varanasi, K. K.; Deng, T.; Chamarthy, P.; Chauhan, S.; DeBock, P.; Kulkarni, A.; Mandrusiak, G.; Rush, B.; Russ, B.; Denault, L.; Weaver, S.; Gerner, F.; Leland, Q.; Yerkes, K. “Engineered Nanostructures for High Thermal Conductivity Substrates”, Proceedings of the Nano Science and Technology Institute, Nanotech Conference and Expo 2009, Houston, Texas, USA.
12. Varanasi, K. K; Deng, T.; Hsu, M,; Bhate, N. “Hierarchical Nanostructures Resist Water Droplet Impact”, Proceedings of the Nano Science and Technology Institute, Nanotech Conference and Expo 2009, Houston, Texas, USA.
13. Deng, T.; Varanasi, K. K.; Hsu, M. F.; Bhate, N.; Keimel, C.; Stein, J.; Blohm M. L. “Non-Wetting of Impinging Droplet on Textured Surfaces”, Applied Physics Letters, 94(13), 133109 (2009).
14.Varanasi, K. K.; Hsu, M. F.; Bhate, N.; Yang, W. S.; Deng, T.; “Spatial control in the heterogeneous nucleation of water”, Applied Physics Letters, 95(9), 094101 (2009).
15.Deng, T.; Cournoyer, J. R.; Schermerhorn, J. H.; Balch, J.; Du, Y.; Blohm, M. L. “Generation and Assembly of Spheroid-like Particles”, Journal of the American Chemical Society, 130(44), 14396-14397 (2008).
