P8D237是半導體，產品優點是波長準確性高、光源穩定性強、光衰低、壽命長。
基本介紹
- 中文名：P8D237
- 品牌：SEOUL首爾半導體
- 產地：韓國（Korea）
- 型號：P8D237
- 產品優點：光衰低、壽命長等
品牌和產地,產品優點,參數,參數圖解,尺寸規格,工作參數,焊接圖示,波長圖示,注意事項,
品牌和產地
品牌：SEOUL首爾半導體（漢半UV LED）
產生：韓國（Korea）
型號：P8D237
產品優點
產品優點：波長準確性高、光源穩定性強、光衰低、壽命長
套用領域：驗鈔、固化、鑒偽紫外殺菌消毒等
封裝方式：仿流明封裝
參數
功率：3W
電壓：12V
波長：375nm
參數圖解
尺寸規格
尺寸規格
尺寸規格
工作參數
工作參數
工作參數
工作參數
工作參數
工作參數
焊接圖示
焊接圖示
波長圖示
波長圖示
注意事項
Notes :
1.Paste thickness : 0.2mm.
2.All dimensions are in millimeters (tolerance : ±0.2 )
3.Scale none
Soldering Profile (Ta=25℃)
1. Reflow Soldering Conditions / Profile
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Emitter Reel Packaging
Note :
1. The number of loaded products in a reel is 250ea.
2. All dimensions are in millimeters.
3. Scale none
*The appearance and specifications of the product may be changed for improvement without notice.
Packaging Structure
Note :
1. 6~10 reels are loaded in a box.
2. Scale none
Precaution for Use
1. Caution
·The devices are UV LEDs. During the operation, The UV LED radiates UV light, which
precaution must be taken to prevent looking directly at the UV light with unaided eyes.
Do not look directly into the UV light or look through the optical system.
If there is a possibility to receive the reflection of UV light, protect by using the UV light
protective glasses so that UV light should not catch one’s eye directly.
2. Storage
·To avoid the moisture penetration, we recommend storing Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature
5 to 30 degrees Centigrade. Humidity 50% maximum.
3. Precaution after opening packaging
·However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
·Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
·Please avoid rapid cooling after soldering.
·Components should not be mounted on warped direction of PCB.
·Anti radioactive ray design is not considered for the products listed here in.
·Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
·This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
·When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
·LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SOC, a sealed container with a nitrogen atmosphere should be
used for storage.
·The appearance and specifications of the product may be modified for improvement without
notice.
·Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
·The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
Handling of Silicone resin LEDS
Power UV LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Power UV LEDs
·Avoid touching silicone resin parts especially by sharp tools such as Tweezers.
·Avoid leaving fingerprints on silicone resin parts.
·Please store the LEDs away from dusty areas or seal the product against dust.
·When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevented.
·Please do not use a force of over 3000 gf impact or pressure diagonally
on the silicon lens. This may cause a catastrophic failure.
·Please do not mold over the silicone lens with another resin.
(epoxy, urethane, etc)
