漢晶

漢晶，女，北京工業大學材料學院副教授。

基本介紹

• 中文名：漢晶
• 學位/學歷：博士
• 職業：教師
• 專業方向：先進電子封裝材料與技術、互連焊點可靠性。
• 就職院校：北京工業大學材料學院

個人經歷

2002/09-2006/07，哈爾濱工業大學，焊接技術與工程，工學學士。

2006/09-2008/07，哈爾濱工業大學，材料加工工程，工學碩士。

2008/09-2013/01，哈爾濱工業大學，材料加工工程，工學博士。

2018/07至今，北京工業大學材料學院，副教授。

2013/08-2018/07，北京工業大學材料學院，講師。

研究方向

先進電子封裝材料與技術；互連焊點可靠性；晶體取向對焊點可靠性影響；焊點界面反應等。

學術成果

[1]漢晶,谷朋浩,郭福.一種BGA用納米顆粒強化焊錫球製備方法.

[2]漢晶,谷朋浩,郭福.實驗室BGA用納米強化焊錫球及抗熱疲勞BGA封裝器件的製備方法.

[1] J. Han, F. Guo, J.P. Liu. Early stages of localized recrystallizationin Pb-free BGA solder joints subjected to thermomechanical stress. Journal ofAlloys & Compounds,

[2] J. Han, F. Guo, J.P. Liu. Recrystallization induced by subgrainrotation in Pb-free BGA solder joints under thermomechanical stress. Journal ofAlloys & Compounds,

[3] J. Han, F. Guo. Nucleation and electromigration-induced grainrotation in an SABI333 solder joint. Journal of Materials Science,

[4] J. Han, F. Guo, J.P. Liu. Effects of anisotropy of tin on grainorientation evolution in Pb-free solder joints under thermomechanical stress.Journal of Materials Science Materials in Electronics,

[5] J. Han, F. Guo. Effects of impurities on double twinning nucleation andgrain refinement of Sn-based solder joints. Journal of Materials ScienceMaterials in Electronics,

[6] J. Han, J. Sun, F. Guo. Recrystallized grain rotation behavior in aPb-free BGA solder joint under electron current stress. Journal of MaterialsScience Materials in Electronics,

[7] J. Han, J. Sun, T. Wen, F. Guo. Dependence of grain orientation inSABI333 solder joints on solidification temperature. Journal of MaterialsScience Materials in Electronics,

[8] J. Han, J. Sun, F. Guo. Analysis of continuous recrystallization(sub)grain rotation behavior in Pb-free solder bumps under a 0.1µm/s shear rate. Journal of MaterialsScience Materials in Electronics,

[9] J. Han, P.H. Gu, L.M. Ma, F. Guo, J.P. Liu. Recrystallization Behaviorin SAC305 and SAC305+3.0POSS Solder Joints Under Thermal Shock. Journal ofElectronic Materials,

[10] J. Han, S.H. Tan, F. Guo. Study on subgrain rotation behavior atdifferent interfaces of a solder joint during thermal shock. Journal ofElectronic Materials,

[11] J. Han, S.H. Tan, F. Guo. Subgrain rotation behavior in theSn3.0Ag0.5Cu-Sn37Pb solder joints during thermal shock. Journal of ElectronicMaterials,

[12] J. Han, Y. Wang, S.H. Tan, F. Guo. Effects of Grain Orientation on Cu₆Sn₅Growth Behaviors for Cu₆Sn₅Reinforced Composite SolderJoints During Electromigration. Journal of Electronic Materials,